Trends and topics to be addressed include:

• How colocation is meeting demand for high density in multi-tenant data center facilities and how best to incorporate these technologies. 
• Designing for AI, addressing questions such as: 
  • What does an AI-optimized data center look like compared to most facilities now? 
  • How are AI workloads driving design decisions for cooling, power distribution, rack form factors and CDUs?
• Cooling redesign 

• Examination of direct-to-chip, in-rack, cooling door, and single-phase and two-phase immersion cooling, discussing which technologies are best for which use cases. 
• Pros and cons of water-based cooling and air-based cooling systems and combinations thereof, across various data center heat management and reuse techniques.